Opportunity radar
4,186,134 patents indexed · 165,974,948 citations · issued 2005-01-04 → 2026-05-05
Showing50 of 4,186,134
Pharma (A61K)Therapy methods (A61P)Med devices (A61M)Agriculture (A01)Hand tools (B25)Consumer (A47)Energy (H01M)AI / ML (G06N)
| Patent # | Title | Assets | Issued | Expires | Fwd cites | Score |
|---|---|---|---|---|---|---|
| 12622302 | Semiconductor package including a lower substrate and an upper substrate | 🖼🧊📄§ | 2026-05-05 | 2042-04-07 | 0 | 31 |
| 12622334 | Semiconductor module | 🖼🧊📄§ | 2026-05-05 | 2045-08-19 | 0 | 31 |
| 12622323 | Semiconductor light emitting element chip integrated device and manufacturing method thereof | 🖼🧊📄§ | 2026-05-05 | 2041-06-15 | 0 | 31 |
| 12622322 | Semiconductor package having ordered wire arrangement between differential pair connection pads | 🖼🧊📄§ | 2026-05-05 | 2042-08-29 | 0 | 31 |
| 12622239 | Sensor comprising pattern illumination-based annealed coated substrate and one or more functional molecules and process of using same | 🖼🧊📄§ | 2026-05-05 | 2041-06-02 | 0 | 31 |
| 12622318 | Wafer to wafer high density interconnects | 🖼🧊📄§ | 2026-05-05 | 2041-12-28 | 0 | 31 |
| 12622335 | Exothermic reactive bonding for semiconductor die assemblies and associated systems and methods | 🖼🧊📄§ | 2026-05-05 | 2042-07-01 | 0 | 31 |
| 12622315 | Semiconductor module | 🖼🧊📄§ | 2026-05-05 | 2043-05-24 | 0 | 31 |
| 12622241 | Structures with convex cavity bottoms | 🖼🧊📄§ | 2026-05-05 | 2043-01-18 | 0 | 31 |
| 12622336 | Bonding layer and process | 🖼🧊📄§ | 2026-05-05 | 2043-05-19 | 0 | 31 |
| 12622311 | Method for assembling EIC to PIC to build an optical engine | 🖼🧊📄§ | 2026-05-05 | 2043-08-14 | 0 | 31 |
| 12622310 | Wafer level fan out semiconductor device and manufacturing method thereof | 🖼🧊📄§ | 2026-05-05 | 2043-12-21 | 0 | 31 |
| 12622244 | Method for manufacturing semiconductor structure with diffusion barrier layers | 🖼🧊📄§ | 2026-05-05 | 2043-08-14 | 0 | 31 |
| 12622332 | Semiconductor package using substrate block integration | 🖼🧊📄§ | 2026-05-05 | 2043-06-29 | 0 | 31 |
| 12622333 | Semiconductor device | 🖼🧊📄§ | 2026-05-05 | 2041-10-01 | 0 | 31 |
| 12622303 | Notched wafer and bonding support structure to improve wafer stacking | 🖼🧊📄§ | 2026-05-05 | 2043-05-03 | 0 | 31 |
| 12622304 | Semiconductor device assembly interconnection pillars and associated methods | 🖼🧊📄§ | 2026-05-05 | 2042-07-28 | 0 | 31 |
| 12622331 | Light emitting device for display and display apparatus having the same | 🖼🧊📄§ | 2026-05-05 | 2044-07-11 | 0 | 31 |
| 12622280 | Semiconductor device with through package via and method therefor | 🖼🧊📄§ | 2026-05-05 | 2042-09-08 | 0 | 31 |
| 12622293 | Semiconductor device | 🖼🧊📄§ | 2026-05-05 | 2043-01-19 | 0 | 31 |
| 12622250 | Vias with vertically non-uniform or discontinuous stack | 🖼🧊📄§ | 2026-05-05 | 2042-03-31 | 0 | 31 |
| 12622252 | Backside contacts for source/drain regions | 🖼🧊📄§ | 2026-05-05 | 2043-05-01 | 0 | 31 |
| 12622275 | Semiconductor package having cooling systems with flow control devices within substrates | 🖼🧊📄§ | 2026-05-05 | 2044-03-26 | 0 | 31 |
| 12622296 | Semiconductor package including metal pattern layer with open region which overlaps non-contact pad | 🖼🧊📄§ | 2026-05-05 | 2043-02-16 | 0 | 31 |
| 12622276 | Interposer including a copper edge seal ring structure and methods of forming the same | 🖼🧊📄§ | 2026-05-05 | 2044-06-13 | 0 | 31 |
| 12622257 | Backside local interconnect | 🖼🧊📄§ | 2026-05-05 | 2043-07-11 | 0 | 31 |
| 12622277 | Semiconductor device and method of partial shielding with embedded graphene core shells | 🖼🧊📄§ | 2026-05-05 | 2043-03-23 | 0 | 31 |
| 12622258 | Self-aligned staggered integrated circuit interconnect features | 🖼🧊📄§ | 2026-05-05 | 2042-06-06 | 0 | 31 |
| 12622259 | Method for fabricating semiconductor structure, and semiconductor structure | 🖼🧊📄§ | 2026-05-05 | 2043-08-03 | 0 | 31 |
| 12622260 | Bottom contact jumpers for stacked field effect transistor semiconductors | 🖼🧊📄§ | 2026-05-05 | 2043-09-19 | 0 | 31 |
| 12622261 | Flexible trackplan for power delivery | 🖼🧊📄§ | 2026-05-05 | 2043-08-12 | 0 | 31 |
| 12622278 | Semiconductor package | 🖼🧊📄§ | 2026-05-05 | 2041-12-27 | 0 | 31 |
| 12622279 | Package with dual layer routing including ground return path | 🖼🧊📄§ | 2026-05-05 | 2038-12-17 | 0 | 31 |
| 12622256 | Conductive via structures for far-end crosstalk cancellation | 🖼🧊📄§ | 2026-05-05 | 2042-08-12 | 0 | 31 |
| 12622255 | Integrated circuit structures with pre-epitaxial deep via structure | 🖼🧊📄§ | 2026-05-05 | 2042-03-31 | 0 | 31 |
| 12622254 | Package structure and method of forming the same | 🖼🧊📄§ | 2026-05-05 | 2044-02-21 | 0 | 31 |
| 12622262 | Low-stress passivation layer | 🖼🧊📄§ | 2026-05-05 | 2043-01-12 | 0 | 31 |
| 12622251 | Via connection structure having multiple via to via connections | 🖼🧊📄§ | 2026-05-05 | 2042-05-26 | 0 | 31 |
| 12622263 | Forming dielectric film with high resistance to tilting | 🖼🧊📄§ | 2026-05-05 | 2042-02-22 | 0 | 31 |
| 12622249 | Method of manufacturing semiconductor structure including a planarization and semiconductor structure thereof | 🖼🧊📄§ | 2026-05-05 | 2043-08-21 | 0 | 31 |
| 12622307 | Controlled grain growth for bonding and bonded structure with controlled grain growth | 🖼🧊📄§ | 2026-05-05 | 2042-12-21 | 0 | 31 |
| 12622248 | Interconnects with sidewall barrier layer divot fill | 🖼🧊📄§ | 2026-05-05 | 2042-12-12 | 0 | 31 |
| 12622247 | Manufacturing method of semiconductor structure | 🖼🧊📄§ | 2026-05-05 | 2043-05-17 | 0 | 31 |
| 12622245 | Ion implant process for defect elimination in metal layer planarization | 🖼🧊📄§ | 2026-05-05 | 2042-07-27 | 0 | 31 |
| 12622281 | Doherty amplifier | 🖼🧊📄§ | 2026-05-05 | 2041-04-07 | 0 | 31 |
| 12622242 | Selective self-assembled monolayer (SAM) removal | 🖼🧊📄§ | 2026-05-05 | 2043-06-13 | 0 | 31 |
| 12622264 | Three-dimensional metal-insulator-metal (MIM) capacitors and trenches | 🖼🧊📄§ | 2026-05-05 | 2043-02-01 | 0 | 31 |
| 12622240 | Dielectric gap fill | 🖼🧊📄§ | 2026-05-05 | 2043-07-31 | 0 | 31 |
| 12622285 | Semiconductor module and method for manufacturing semiconductor module | 🖼🧊📄§ | 2026-05-05 | 2043-03-10 | 0 | 31 |
| 12622265 | Stacked semiconductor device including a cooling structure | 🖼🧊📄§ | 2026-05-05 | 2043-08-08 | 0 | 31 |